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Low temperature cofired ceramic material, ceramic sintered body, and ceramic electronic component
A mixed powder for a low temperature cofired ceramic material that contains 65 to 80 parts by weight of SiO2, 5 to 25 parts by weight of BaO, 1 to 10 parts by weight of Al2O3, 0.1 to 5 parts by weight of MnO, 0.1 to 5 parts by weight of B2O3, and 0.1 to less than 3 parts by weight of Li2O. The ceramic sintered body is used for, for example, ceramic electronic components, e.g., a multilayer circuit board or a coupler.
Low temperature cofired ceramic material, ceramic sintered body, and ceramic electronic component
A mixed powder for a low temperature cofired ceramic material that contains 65 to 80 parts by weight of SiO2, 5 to 25 parts by weight of BaO, 1 to 10 parts by weight of Al2O3, 0.1 to 5 parts by weight of MnO, 0.1 to 5 parts by weight of B2O3, and 0.1 to less than 3 parts by weight of Li2O. The ceramic sintered body is used for, for example, ceramic electronic components, e.g., a multilayer circuit board or a coupler.
Low temperature cofired ceramic material, ceramic sintered body, and ceramic electronic component
SUGIMOTO YASUTAKA (Autor:in) / KANEKO KAZUHIRO (Autor:in)
02.02.2021
Patent
Elektronische Ressource
Englisch
IPC:
C04B
Kalk
,
LIME
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C03C
Chemische Zusammensetzungen für Gläser, Glasuren oder Emails
,
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS
/
H01B
CABLES
,
Kabel
/
H03H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
,
Scheinwiderstandsnetzwerke, z.B. Resonanzkreise
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
LOW TEMPERATURE COFIRED CERAMIC MATERIAL, CERAMIC SINTERED BODY, AND CERAMIC ELECTRONIC COMPONENT
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