Multilayer electronic component and method for manufacturing multilayer electronic component: Fid-Bau Portal

Fachinformationsdienst BAUdigital

Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik

Multilayer electronic component and method for manufacturing multilayer electronic component

FUJII HISASHI / SAITO YOSHITO / MASUDA MASAKI / TAMURA HIDEKAZU

A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers, the multilayer body including an electrode facing portion in which the inner electrode layers are laminated to face each other with the dielectric layers interposed therebetween. The multilayer body has a thickness of at least about 1.5 mm in a lamination direction, a length of at least about 3.0 mm, and a width of at least about 1.5 mm. Each of the dielectric layers includes Ba, Ti, and Cl. A Cl concentration C1 in the entire electrode facing portion satisfies about 10 wtppm

Zugriff

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Multilayer electronic component and method for manufacturing multilayer electronic component

FUJII HISASHI / SAITO YOSHITO / MASUDA MASAKI / TAMURA HIDEKAZU

A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers, the multilayer body including an electrode facing portion in which the inner electrode layers are laminated to face each other with the dielectric layers interposed therebetween. The multilayer body has a thickness of at least about 1.5 mm in a lamination direction, a length of at least about 3.0 mm, and a width of at least about 1.5 mm. Each of the dielectric layers includes Ba, Ti, and Cl. A Cl concentration C1 in the entire electrode facing portion satisfies about 10 wtppm

Multilayer electronic component and method for manufacturing multilayer electronic component

FUJII HISASHI / SAITO YOSHITO / MASUDA MASAKI / TAMURA HIDEKAZU

A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers, the multilayer body including an electrode facing portion in which the inner electrode layers are laminated to face each other with the dielectric layers interposed therebetween. The multilayer body has a thickness of at least about 1.5 mm in a lamination direction, a length of at least about 3.0 mm, and a width of at least about 1.5 mm. Each of the dielectric layers includes Ba, Ti, and Cl. A Cl concentration C1 in the entire electrode facing portion satisfies about 10 wtppm

Zugriff

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

Multilayer electronic component and method for manufacturing multilayer electronic component

Beteiligte:

FUJII HISASHI (Autor:in) / SAITO YOSHITO (Autor:in) / MASUDA MASAKI (Autor:in) / TAMURA HIDEKAZU (Autor:in)

Erscheinungsdatum:

14.02.2023

Medientyp:

Patent

Format:

Elektronische Ressource

Sprache:

Englisch

Klassifikation:

IPC: H01G Kondensatoren , CAPACITORS / C04B Kalk , LIME

Ähnliche Titel

MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT

FUJII HISASHI / SAITO YOSHITO / MASUDA MASAKI et al. | Europäisches Patentamt | 2021

Freier Zugriff

Multilayer Electronic Component and Method for Manufacturing Multilayer Electronic Component

Europäisches Patentamt | 2022

Freier Zugriff

MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT

HASHIMOTO HIDEYUKI | Europäisches Patentamt | 2020

Freier Zugriff

Multilayer Electronic Component and Method for Manufacturing Multilayer Electronic Component

HASHIMOTO HIDEYUKI | Europäisches Patentamt | 2021

Freier Zugriff

Multilayer electronic component and method for manufacturing multilayer electronic component

HASHIMOTO HIDEYUKI | Europäisches Patentamt | 2022

Freier Zugriff