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Multilayer electronic component and method for manufacturing multilayer electronic component
A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers, the multilayer body including an electrode facing portion in which the inner electrode layers are laminated to face each other with the dielectric layers interposed therebetween. The multilayer body has a thickness of at least about 1.5 mm in a lamination direction, a length of at least about 3.0 mm, and a width of at least about 1.5 mm. Each of the dielectric layers includes Ba, Ti, and Cl. A Cl concentration C1 in the entire electrode facing portion satisfies about 10 wtppm
Multilayer electronic component and method for manufacturing multilayer electronic component
A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers, the multilayer body including an electrode facing portion in which the inner electrode layers are laminated to face each other with the dielectric layers interposed therebetween. The multilayer body has a thickness of at least about 1.5 mm in a lamination direction, a length of at least about 3.0 mm, and a width of at least about 1.5 mm. Each of the dielectric layers includes Ba, Ti, and Cl. A Cl concentration C1 in the entire electrode facing portion satisfies about 10 wtppm
Multilayer electronic component and method for manufacturing multilayer electronic component
FUJII HISASHI (author) / SAITO YOSHITO (author) / MASUDA MASAKI (author) / TAMURA HIDEKAZU (author)
2023-02-14
Patent
Electronic Resource
English
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