Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Dielectric film, dielectric element, and electronic circuit board
A dielectric film includes a main component of a complex oxide represented by a general formula of (Sr1-xCax)yTiO3. 0.40≤x≤0.90 and 0.90≤y≤1.10 are satisfied. A ratio of a diffraction peak intensity on (1, 1, 2) plane of the complex oxide to a diffraction peak intensity on (0, 0, 4) plane of the complex oxide in an X-ray diffraction chart of the dielectric film is 3.00 or more. Instead, a ratio of an intensity of a diffraction peak appearing at a diffraction angle 2θ of 32° or more and 34° or less to an intensity of a diffraction peak appearing at a diffraction angle 2θ of 46° or more and 48° or less in an X-ray diffraction chart of the dielectric film obtained by an X-ray diffraction measurement with Cu-Kα ray as an X-ray source is 3.00 or more.
Dielectric film, dielectric element, and electronic circuit board
A dielectric film includes a main component of a complex oxide represented by a general formula of (Sr1-xCax)yTiO3. 0.40≤x≤0.90 and 0.90≤y≤1.10 are satisfied. A ratio of a diffraction peak intensity on (1, 1, 2) plane of the complex oxide to a diffraction peak intensity on (0, 0, 4) plane of the complex oxide in an X-ray diffraction chart of the dielectric film is 3.00 or more. Instead, a ratio of an intensity of a diffraction peak appearing at a diffraction angle 2θ of 32° or more and 34° or less to an intensity of a diffraction peak appearing at a diffraction angle 2θ of 46° or more and 48° or less in an X-ray diffraction chart of the dielectric film obtained by an X-ray diffraction measurement with Cu-Kα ray as an X-ray source is 3.00 or more.
Dielectric film, dielectric element, and electronic circuit board
ASAHI TOSHIO (Autor:in) / HAEMORI MASAMITSU (Autor:in) / SAITA HITOSHI (Autor:in)
23.05.2023
Patent
Elektronische Ressource
Englisch
IPC:
C01G
Verbindungen der von den Unterklassen C01D oder C01F nicht umfassten Metalle
,
COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
/
C04B
Kalk
,
LIME
/
C23C
Beschichten metallischer Werkstoffe
,
COATING METALLIC MATERIAL
/
H01G
Kondensatoren
,
CAPACITORS
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
DIELECTRIC THIN FILM, DIELECTRIC ELEMENT AND ELECTRONIC CIRCUIT BOARD
| Europäisches Patentamt | 2021
Dielectric thin film, dielectric element and electronic circuit board
| Europäisches Patentamt | 2022
DIELECTRIC COMPOSITION, DIELECTRIC THIN FILM, DIELECTRIC ELEMENT, AND ELECTRONIC CIRCUIT BOARD
| Europäisches Patentamt | 2021
DIELECTRIC THIN FILM, CAPACITIVE ELEMENT AND ELECTRONIC CIRCUIT SUBSTRATE
| Europäisches Patentamt | 2020
DIELECTRIC THIN FILM, ELECTRONIC COMPONENT, THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD
| Europäisches Patentamt | 2020