Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
CERAMIC COMPONENT AND METHOD OF MANUFACTURING CERAMIC COMPONENT
The present disclosure relates to a ceramic component including a boron carbide, wherein a difference of a first residual stress measured at a first spot on a surface of the ceramic component and a second residual stress measured at a second spot on the surface having different distance from a center of the surface than the first spot is −600 to +600 MPa.
CERAMIC COMPONENT AND METHOD OF MANUFACTURING CERAMIC COMPONENT
The present disclosure relates to a ceramic component including a boron carbide, wherein a difference of a first residual stress measured at a first spot on a surface of the ceramic component and a second residual stress measured at a second spot on the surface having different distance from a center of the surface than the first spot is −600 to +600 MPa.
CERAMIC COMPONENT AND METHOD OF MANUFACTURING CERAMIC COMPONENT
HWANG SUNGSIC (Autor:in) / OH JUNROK (Autor:in) / MIN KYUNGYEOL (Autor:in) / KIM KYUNGIN (Autor:in) / KANG JUNGKUN (Autor:in) / HAN YOUNGUK (Autor:in)
01.12.2022
Patent
Elektronische Ressource
Englisch
IPC:
C04B
Kalk
,
LIME
/
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
/
H01J
Elektrische Entladungsröhren oder Entladungslampen
,
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
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