Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate: Fid-Bau Portal

Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

TERASAKI NOBUYUKI / NAGATOMO YOSHIYUKI / KUROMITSU YOSHIROU

Abstract

A power module substrate includes a circuit layer, an aluminum layer arranged on a surface of an insulation layer, and a copper layer laminated on one side of the aluminum layer. The aluminum layer and the copper layer are bonded together by solid phase diffusion bonding.

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Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

TERASAKI NOBUYUKI / NAGATOMO YOSHIYUKI / KUROMITSU YOSHIROU

Abstract

Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

TERASAKI NOBUYUKI / NAGATOMO YOSHIYUKI / KUROMITSU YOSHIROU

Abstract

Zugriff

Download

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

Beteiligte:

TERASAKI NOBUYUKI (Autor:in) / NAGATOMO YOSHIYUKI (Autor:in) / KUROMITSU YOSHIROU (Autor:in)

Erscheinungsdatum:

01.08.2017

Medientyp:

Patent

Format:

Elektronische Ressource

Sprache:

Englisch

Klassifikation:

IPC: H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B23K Löten , SOLDERING OR UNSOLDERING / C04B Kalk , LIME / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES

Europäisches Patentamt | 2017

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