Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

    New search for: TERASAKI NOBUYUKI
    New search for: NAGATOMO YOSHIYUKI
    New search for: KUROMITSU YOSHIROU

    A power module substrate includes a circuit layer, an aluminum layer arranged on a surface of an insulation layer, and a copper layer laminated on one side of the aluminum layer. The aluminum layer and the copper layer are bonded together by solid phase diffusion bonding.

    Access

    Download

    Access

    Download

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

    New search for: TERASAKI NOBUYUKI
    New search for: NAGATOMO YOSHIYUKI
    New search for: KUROMITSU YOSHIROU

    A power module substrate includes a circuit layer, an aluminum layer arranged on a surface of an insulation layer, and a copper layer laminated on one side of the aluminum layer. The aluminum layer and the copper layer are bonded together by solid phase diffusion bonding.

    Access

    Download

    Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

    New search for: TERASAKI NOBUYUKI
    New search for: NAGATOMO YOSHIYUKI
    New search for: KUROMITSU YOSHIROU

    A power module substrate includes a circuit layer, an aluminum layer arranged on a surface of an insulation layer, and a copper layer laminated on one side of the aluminum layer. The aluminum layer and the copper layer are bonded together by solid phase diffusion bonding.

    Access

    Download

    Access

    Download

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

    Contributors:

    TERASAKI NOBUYUKI (author) / NAGATOMO YOSHIYUKI (author) / KUROMITSU YOSHIROU (author)

    Publication date:

    2017-08-01

    Type of media:

    Patent

    Type of material:

    Electronic Resource

    Language:

    English

    Classification:

    IPC:  H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B23K Löten , SOLDERING OR UNSOLDERING / C04B Kalk , LIME / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES

    Similar titles

    SUBSTRATE FOR POWER MODULE SUBSTRATE WITH HEAT SINK FOR POWER MODULE POWER MODULE METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE AND METHOD FOR PRODUCING SUBSTRATE WITH HEAT SINK FOR POWER MODULE

    European Patent Office | 2017

    Free access

    Power module substrate, power module substrate with metal part, power module with metal part, method for producing power module substrate, and method for producing power module substrate with metal part

    NISHIMOTO SHUJI / NAGATOMO YOSHIYUKI | European Patent Office | 2017

    Free access

    Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate

    KUROMITSU YOSHIROU / NAGATOMO YOSHIYUKI / TERASAKI NOBUYUKI et al. | European Patent Office | 2015

    Free access

    Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module

    NAGATOMO YOSHIYUKI / AKIYAMA KAZUHIRO / TONOMURA HIROSHI et al. | European Patent Office | 2016

    Free access

    SUBSTRATE FOR POWER MODULE, SUBSTRATE WITH HEAT SINK FOR POWER MODULE, POWER MODULE, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE, AND METHOD FOR PRODUCING SUBSTRATE WITH HEAT SINK FOR POWER MODULE

    NAGATOMO YOSHIYUKI / AKIYAMA KAZUHIRO / TONOMURA HIROSHI et al. | European Patent Office | 2023

    Free access
    Back to top