Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Physical Properties of Plywood and Waferboard as Pile Cushion Materials
Physical Properties of Plywood and Waferboard as Pile Cushion Materials
Physical Properties of Plywood and Waferboard as Pile Cushion Materials
Womack, Kevin C. (Autor:in) / Whitaker, Aaron M. / Caliendo, Joseph A. / Goble, George G. / Halling, Marvin W.
2003
Aufsatz (Zeitschrift)
Englisch
BKL:
56.20
Ingenieurgeologie, Bodenmechanik
Physical Properties of Plywood and Waferboard as Pile Cushion Materials
British Library Online Contents | 2003
|TIBKAT | 1986
|An Innovative Stressed Skin Panel System Using Corrugated Waferboard
British Library Conference Proceedings | 1995
|A New Type of Pile – Long with Cushion-Short without Cushion Rigid Pile
Tema Archiv | 2012
|A New Type of Pile – Long with Cushion-Short without Cushion Rigid Pile
Trans Tech Publications | 2012
|