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Physical Properties of Plywood and Waferboard as Pile Cushion Materials

Womack, Kevin C.

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Physical Properties of Plywood and Waferboard as Pile Cushion Materials

Womack, Kevin C.

Physical Properties of Plywood and Waferboard as Pile Cushion Materials

Womack, Kevin C.

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Access via TIB

Check availability in my library

Order at Subito €

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Title:

Physical Properties of Plywood and Waferboard as Pile Cushion Materials

Contributors:

Womack, Kevin C. (author) / Whitaker, Aaron M. / Caliendo, Joseph A. / Goble, George G. / Halling, Marvin W.

Published in:

Journal of geotechnical and geoenvironmental engineering ; 129

Publication date:

2003

ISSN:

1090-0241

Type of media:

Article (Journal)

Type of material:

Language:

English

Keywords:

Zeitschrift , Grundbau , Bodenmechanik , Geotechnik

Classification:

BKL: 56.20 Ingenieurgeologie, Bodenmechanik

Womack, K. C. / Whitaker, A. M. / Caliendo, J. A. et al. | British Library Online Contents | 2003

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