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SOLDERING METHOD FOR JOINTING SOLDER TO CERAMIC
PROBLEM TO BE SOLVED: To provide a soldering method capable of joining ceramic and metal or ceramics each other by a high temperature solder by directly joining the solder with using the high temperature solder having the melting point of 350 to 450°C without a preliminary treatment of a solder joining surface of ceramic by plating.SOLUTION: Solder containing 0.1 to 18 mass% of Al, mainly containing Zn and having the melting point of 350 to 450°C is used to joint directly to ceramic by conducting friction soldering while adding ultrasonic vibration. The solder may contain further Si in a range of 0.01 to 0.5 mass% and Ni in a range of 0.3 to 2.0 mass%.SELECTED DRAWING: Figure 5
【課題】融点が３５０〜４５０℃の高温ハンダ使用し、セラミックのハンダ接合面をメッキなどの予備処理することなしに、直接、ハンダを接合することにより、セラミックと金属とを、あるいはセラミック同士を、高温ハンダで接合可能するハンダ付け方法を提供する。【解決手段】０．１〜１８質量％のＡｌを含有し、Ｚｎを主成分とする融点が３５０〜４５０℃のハンダを用いて、超音波振動を付与しつつ摩擦ハンダ付けを行うことにより、セラミックに、直接、接合する。ハンダには、さらにＳｉを０．０１〜０．５質量％の範囲で、またＮｉを０．３〜２．０質量％の範囲で含有してもよい。【選択図】図５
SOLDERING METHOD FOR JOINTING SOLDER TO CERAMIC
PROBLEM TO BE SOLVED: To provide a soldering method capable of joining ceramic and metal or ceramics each other by a high temperature solder by directly joining the solder with using the high temperature solder having the melting point of 350 to 450°C without a preliminary treatment of a solder joining surface of ceramic by plating.SOLUTION: Solder containing 0.1 to 18 mass% of Al, mainly containing Zn and having the melting point of 350 to 450°C is used to joint directly to ceramic by conducting friction soldering while adding ultrasonic vibration. The solder may contain further Si in a range of 0.01 to 0.5 mass% and Ni in a range of 0.3 to 2.0 mass%.SELECTED DRAWING: Figure 5
【課題】融点が３５０〜４５０℃の高温ハンダ使用し、セラミックのハンダ接合面をメッキなどの予備処理することなしに、直接、ハンダを接合することにより、セラミックと金属とを、あるいはセラミック同士を、高温ハンダで接合可能するハンダ付け方法を提供する。【解決手段】０．１〜１８質量％のＡｌを含有し、Ｚｎを主成分とする融点が３５０〜４５０℃のハンダを用いて、超音波振動を付与しつつ摩擦ハンダ付けを行うことにより、セラミックに、直接、接合する。ハンダには、さらにＳｉを０．０１〜０．５質量％の範囲で、またＮｉを０．３〜２．０質量％の範囲で含有してもよい。【選択図】図５
SOLDERING METHOD FOR JOINTING SOLDER TO CERAMIC
セラミックにハンダを接合するハンダ付け方法
HASEGAWA MASAYUKI (author) / OKAMOTO KENTARO (author) / HOBO HIROKI (author)
2016-05-30
Patent
Electronic Resource
Japanese
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