A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Thermal fatigue life prediction of flip chip solder joints by fracture mechanics method
Thermal fatigue life prediction of flip chip solder joints by fracture mechanics method
Thermal fatigue life prediction of flip chip solder joints by fracture mechanics method
Lau, J. H. (author)
ENGINEERING FRACTURE MECHANICS ; 45 ; 643
1993-01-01
643 pages
Article (Journal)
Unknown
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