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Mesomechanical modelling of SnAgCu solder joints in flip chip

Gong, J. / Liu, C. / Conway, P. P. / Silberschmidt, V. V.

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Mesomechanical modelling of SnAgCu solder joints in flip chip

Gong, J. / Liu, C. / Conway, P. P. / Silberschmidt, V. V.

Mesomechanical modelling of SnAgCu solder joints in flip chip

Gong, J. / Liu, C. / Conway, P. P. / Silberschmidt, V. V.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

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Document information

Title:

Mesomechanical modelling of SnAgCu solder joints in flip chip

Contributors:

Gong, J. (author) / Liu, C. (author) / Conway, P. P. (author) / Silberschmidt, V. V. (author)

Published in:

COMPUTATIONAL MATERIALS SCIENCE ; 43 ; 199-211

Publication date:

2008-01-01

Size:

13 pages

ISSN:

0927-0256

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1 / 510

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