Stress development and relaxation in copper films during thermal cycling: Fid-Bau Portal

Stress development and relaxation in copper films during thermal cycling

Thouless, M. D. / Gupta, J. / Harper, J. M. E.

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Stress development and relaxation in copper films during thermal cycling

Thouless, M. D. / Gupta, J. / Harper, J. M. E.

Stress development and relaxation in copper films during thermal cycling

Thouless, M. D. / Gupta, J. / Harper, J. M. E.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Stress development and relaxation in copper films during thermal cycling

Contributors:

Thouless, M. D. (author) / Gupta, J. (author) / Harper, J. M. E. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 8 ; 1845

Publication date:

1993-01-01

Size:

1845 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.11

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