Evolution of Surface Morphologies in Sputtered and Electroplated Cu Films during Thermal Cycling

Hwang, S.-J. / Park, H. / Lee, J.-H. et al. | British Library Online Contents | 2002

Stress development and relaxation in copper films during thermal cycling

Thouless, M. D. / Gupta, J. / Harper, J. M. E. | British Library Online Contents | 1993

Stress evolution in copper-silver thin films during thermal-cycling

Chama, C. C. / Vlassak, J. J. / Soboyejo, W. O. | British Library Online Contents | 2012

Thermal Stress Behavior of Diffusion-bonded SiC/6061Al Laminates during Thermal Cycling

Li, H. / Li, J. / Wang, Z. et al. | British Library Online Contents | 1999

Effect of passivation on stress relaxation in electroplated copper films

Gan, D. / Ho, P. S. / Pang, Y. et al. | British Library Online Contents | 2006