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    Stress Measurement by Copper Electroplating Based on Grain Growth

    New search for: Kato, A.

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    Stress Measurement by Copper Electroplating Based on Grain Growth

    New search for: Kato, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Stress Measurement by Copper Electroplating Based on Grain Growth

    New search for: Kato, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Stress Measurement by Copper Electroplating Based on Grain Growth

    Contributors:

    Kato, A. (author)

    Published in:

    EXPERIMENTAL MECHANICS ; 35 ; 24

    Publication date:

    1995-01-01

    Size:

    24 pages

    ISSN:

    0014-4851

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.1

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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