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    Effect of solder bump geometry on the microstructure of Sn-3.5 wt% Ag on electroless nickel immersion gold during solder dipping

    New search for: Huang, Z.
    New search for: Conway, P. P.
    New search for: Liu, C.
    New search for: Thomson, R. C.

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    Effect of solder bump geometry on the microstructure of Sn-3.5 wt% Ag on electroless nickel immersion gold during solder dipping

    New search for: Huang, Z.
    New search for: Conway, P. P.
    New search for: Liu, C.
    New search for: Thomson, R. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of solder bump geometry on the microstructure of Sn-3.5 wt% Ag on electroless nickel immersion gold during solder dipping

    New search for: Huang, Z.
    New search for: Conway, P. P.
    New search for: Liu, C.
    New search for: Thomson, R. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of solder bump geometry on the microstructure of Sn-3.5 wt% Ag on electroless nickel immersion gold during solder dipping

    Contributors:

    Huang, Z. (author) / Conway, P. P. (author) / Liu, C. (author) / Thomson, R. C. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 649-658

    Publication date:

    2005-01-01

    Size:

    10 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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