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Phenol-formaldehyde resin curing and bonding under dynamic conditions
Phenol-formaldehyde resin curing and bonding under dynamic conditions
Phenol-formaldehyde resin curing and bonding under dynamic conditions
Wang, X.-M. (author) / Riedl, B. (author) / Geimer, R. L. (author) / Christiansen, A. W. (author)
WOOD SCIENCE AND TECHNOLOGY -NEW YORK- ; 30 ; 423-442
1996-01-01
20 pages
Article (Journal)
English
DDC:
620.12
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