Evaluation of Ni-In-Ni multi-layers for thermally stable ohmic contacts to n-GaAs: Fid-Bau Portal

Evaluation of Ni-In-Ni multi-layers for thermally stable ohmic contacts to n-GaAs

Hsia, S. T. / Hwang, H. L. / Lee, C. P.

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Evaluation of Ni-In-Ni multi-layers for thermally stable ohmic contacts to n-GaAs

Hsia, S. T. / Hwang, H. L. / Lee, C. P.

Evaluation of Ni-In-Ni multi-layers for thermally stable ohmic contacts to n-GaAs

Hsia, S. T. / Hwang, H. L. / Lee, C. P.

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Order at Subito €

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Document information

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Document information

Title:

Evaluation of Ni-In-Ni multi-layers for thermally stable ohmic contacts to n-GaAs

Contributors:

Hsia, S. T. (author) / Hwang, H. L. (author) / Lee, C. P. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- B ; 33 ; 178

Publication date:

1995-01-01

Size:

178 pages

ISSN:

0921-5107

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.11

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