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Solid state intermetallic compound layer growth between copper and hot dipped indium coatings

Vianco, P. T. / Kilgo, A. C. / Grant, R.

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Solid state intermetallic compound layer growth between copper and hot dipped indium coatings

Vianco, P. T. / Kilgo, A. C. / Grant, R.

Solid state intermetallic compound layer growth between copper and hot dipped indium coatings

Vianco, P. T. / Kilgo, A. C. / Grant, R.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Solid state intermetallic compound layer growth between copper and hot dipped indium coatings

Contributors:

Vianco, P. T. (author) / Kilgo, A. C. (author) / Grant, R. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 30 ; 4871

Publication date:

1995-01-01

Size:

4871 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.11

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