Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Indium Addition on Intermetallic Compound Evolution in Tin-Silver Solder Bump

    New search for: Wang, D.
    New search for: Yuan, Y.
    New search for: Luo, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Indium Addition on Intermetallic Compound Evolution in Tin-Silver Solder Bump

    New search for: Wang, D.
    New search for: Yuan, Y.
    New search for: Luo, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Indium Addition on Intermetallic Compound Evolution in Tin-Silver Solder Bump

    New search for: Wang, D.
    New search for: Yuan, Y.
    New search for: Luo, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Indium Addition on Intermetallic Compound Evolution in Tin-Silver Solder Bump

    Contributors:

    Wang, D. (author) / Yuan, Y. (author) / Luo, L. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 52 ; 1522-1524

    Publication date:

    2011-01-01

    Size:

    3 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy

    Jang, D.M. / Yu, J. | British Library Online Contents | 2011

    Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

    Kim, D. G. / Jang, H. S. / Kim, Y. J. et al. | British Library Online Contents | 2005

    Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy

    Kim, D.-G. / Jung, S.-B. | British Library Online Contents | 2005

    Evolution of Intermetallic Compound at the Interface between AuSn Solder and Metallization Layer

    Wei, Z. / Chunqing, W. / Bohan, Y. | British Library Online Contents | 2006

    Influence of indium addition on electromigration behavior of solder joint

    Lee, K. / Kim, K.-S. / Suganuma, K. | British Library Online Contents | 2011

    Back to top