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Grain Size Analysis in Electrodeposited Cu-Coatings

Schlaefer, S. / Klimanek, P. / Handreg, I. / Heinzel, G. / Lange, G.

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Grain Size Analysis in Electrodeposited Cu-Coatings

Schlaefer, S. / Klimanek, P. / Handreg, I. / Heinzel, G. / Lange, G.

Grain Size Analysis in Electrodeposited Cu-Coatings

Schlaefer, S. / Klimanek, P. / Handreg, I. / Heinzel, G. / Lange, G.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Grain Size Analysis in Electrodeposited Cu-Coatings

Contributors:

Schlaefer, S. (author) / Klimanek, P. (author) / Handreg, I. (author) / Heinzel, G. (author) / Lange, G. (author)

Published in:

MATERIALS SCIENCE FORUM ; 457-462

Publication date:

1996-01-01

Size:

6 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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