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    Relationship between hardness and grain size in electrodeposited copper films

    New search for: Hakamada, M.
    New search for: Nakamoto, Y.
    New search for: Matsumoto, H.
    New search for: Iwasaki, H.
    New search for: Chen, Y.
    New search for: Kusuda, H.
    New search for: Mabuchi, M.

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    Relationship between hardness and grain size in electrodeposited copper films

    New search for: Hakamada, M.
    New search for: Nakamoto, Y.
    New search for: Matsumoto, H.
    New search for: Iwasaki, H.
    New search for: Chen, Y.
    New search for: Kusuda, H.
    New search for: Mabuchi, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Relationship between hardness and grain size in electrodeposited copper films

    New search for: Hakamada, M.
    New search for: Nakamoto, Y.
    New search for: Matsumoto, H.
    New search for: Iwasaki, H.
    New search for: Chen, Y.
    New search for: Kusuda, H.
    New search for: Mabuchi, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Relationship between hardness and grain size in electrodeposited copper films

    Contributors:

    Hakamada, M. (author) / Nakamoto, Y. (author) / Matsumoto, H. (author) / Iwasaki, H. (author) / Chen, Y. (author) / Kusuda, H. (author) / Mabuchi, M. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 457 ; 120-126

    Publication date:

    2007-01-01

    Size:

    7 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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