Microstructure, electrical properties, and thermal stability of Al ohmic contacts to n-GaN: Fid-Bau Portal

Microstructure, electrical properties, and thermal stability of Al ohmic contacts to n-GaN

Smith, L. L. / Davis, R. F. / Kim, M. J. / Carpenter, R. W. / Huang, Y.

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Microstructure, electrical properties, and thermal stability of Al ohmic contacts to n-GaN

Smith, L. L. / Davis, R. F. / Kim, M. J. / Carpenter, R. W. / Huang, Y.

Microstructure, electrical properties, and thermal stability of Al ohmic contacts to n-GaN

Smith, L. L. / Davis, R. F. / Kim, M. J. / Carpenter, R. W. / Huang, Y.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Microstructure, electrical properties, and thermal stability of Al ohmic contacts to n-GaN

Contributors:

Smith, L. L. (author) / Davis, R. F. (author) / Kim, M. J. (author) / Carpenter, R. W. (author) / Huang, Y. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 11 ; 2257-2262

Publication date:

1996-01-01

Size:

6 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Smith, L. L. / Davis, R. F. / Kim, M. J. et al. | British Library Online Contents | 1997

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