Thermal stability of WSi"x and W ohmic contacts on GaN: Fid-Bau Portal

Thermal stability of WSi"x and W ohmic contacts on GaN

Cao, X.A. / Pearton, S.J. / Donovan, S.M. / Abernathy, C.R. / Ren, F. / Zolper, J.C. / Cole, M.W. / Zeitouny, A. / Eizenberg, M. / Shul, R.J.

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Thermal stability of WSi"x and W ohmic contacts on GaN

Cao, X.A. / Pearton, S.J. / Donovan, S.M. / Abernathy, C.R. / Ren, F. / Zolper, J.C. / Cole, M.W. / Zeitouny, A. / Eizenberg, M. / Shul, R.J.

Thermal stability of WSi"x and W ohmic contacts on GaN

Cao, X.A. / Pearton, S.J. / Donovan, S.M. / Abernathy, C.R. / Ren, F. / Zolper, J.C. / Cole, M.W. / Zeitouny, A. / Eizenberg, M. / Shul, R.J.

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Document information

Title:

Thermal stability of WSi"x and W ohmic contacts on GaN

Contributors:

Cao, X.A. (author) / Pearton, S.J. (author) / Donovan, S.M. (author) / Abernathy, C.R. (author) / Ren, F. (author) / Zolper, J.C. (author) / Cole, M.W. (author) / Zeitouny, A. (author) / Eizenberg, M. (author) / Shul, R.J. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- B ; 59 ; 362 - 365

Publication date:

1999-01-01

Size:

4 pages

ISSN:

0921-5107

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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