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    The influence of post-bond heat treatment on microstructural development in martensite-forming NiAl-NiTi transient liquid phase bonds employing copper interlayers

    New search for: Gale, W. F.
    New search for: Guan, Y.

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    The influence of post-bond heat treatment on microstructural development in martensite-forming NiAl-NiTi transient liquid phase bonds employing copper interlayers

    New search for: Gale, W. F.
    New search for: Guan, Y.

    Access

    Access via TIB
    Check availability in my library
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    The influence of post-bond heat treatment on microstructural development in martensite-forming NiAl-NiTi transient liquid phase bonds employing copper interlayers

    New search for: Gale, W. F.
    New search for: Guan, Y.

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Title:

    The influence of post-bond heat treatment on microstructural development in martensite-forming NiAl-NiTi transient liquid phase bonds employing copper interlayers

    Contributors:

    Gale, W. F. (author) / Guan, Y. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 32 ; 2543-2547

    Publication date:

    1997-01-01

    Size:

    5 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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