Influence of Grain Boundary Structure on Bubble Formation Behaviour in Helium Implanted Copper: Fid-Bau Portal

Influence of Grain Boundary Structure on Bubble Formation Behaviour in Helium Implanted Copper

Thorsen, P. A. / Bilde-Soerensen, J. B. / Singh, B. N.

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Influence of Grain Boundary Structure on Bubble Formation Behaviour in Helium Implanted Copper

Thorsen, P. A. / Bilde-Soerensen, J. B. / Singh, B. N.

Influence of Grain Boundary Structure on Bubble Formation Behaviour in Helium Implanted Copper

Thorsen, P. A. / Bilde-Soerensen, J. B. / Singh, B. N.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Influence of Grain Boundary Structure on Bubble Formation Behaviour in Helium Implanted Copper

Contributors:

Thorsen, P. A. (author) / Bilde-Soerensen, J. B. (author) / Singh, B. N. (author)

Published in:

MATERIALS SCIENCE FORUM ; 445-448

Publication date:

1996-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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