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Influence of Grain Boundary Structure on Bubble Formation Behaviour in Helium Implanted Copper
Influence of Grain Boundary Structure on Bubble Formation Behaviour in Helium Implanted Copper
Influence of Grain Boundary Structure on Bubble Formation Behaviour in Helium Implanted Copper
Thorsen, P. A. (Autor:in) / Bilde-Soerensen, J. B. (Autor:in) / Singh, B. N. (Autor:in)
MATERIALS SCIENCE FORUM ; 445-448
01.01.1996
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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