Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Rapid transient-liquid-phase bonding of Al~2O~3 with microdesigned Ni/Nb/Ni interlayers

    New search for: Hong, S.M.
    New search for: Reynolds, T.B.
    New search for: Bartlow, C.C.
    New search for: Glaeser, A.M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Rapid transient-liquid-phase bonding of Al~2O~3 with microdesigned Ni/Nb/Ni interlayers

    New search for: Hong, S.M.
    New search for: Reynolds, T.B.
    New search for: Bartlow, C.C.
    New search for: Glaeser, A.M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Rapid transient-liquid-phase bonding of Al~2O~3 with microdesigned Ni/Nb/Ni interlayers

    New search for: Hong, S.M.
    New search for: Reynolds, T.B.
    New search for: Bartlow, C.C.
    New search for: Glaeser, A.M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Rapid transient-liquid-phase bonding of Al~2O~3 with microdesigned Ni/Nb/Ni interlayers

    Contributors:

    Hong, S.M. (author) / Reynolds, T.B. (author) / Bartlow, C.C. (author) / Glaeser, A.M. (author)

    Published in:

    INTERNATIONAL JOURNAL OF MATERIALS RESEARCH ; 101 ; 133-142

    Publication date:

    2010-01-01

    Size:

    10 pages

    ISSN:

    1862-5282

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  669.9

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Transient liquid phase bonding of a microduplex stainless steel using amorphous interlayers

    Khan, T. I. / Orhan, N. / Eroglu, M. | British Library Online Contents | 2002

    Partial transient liquid-phase bonding of Si~3N~4 with Ti/Cu/Ni multi-interlayers

    Zheng, C. / Lou, H. / Fei, Z. et al. | British Library Online Contents | 1997

    Modelling the transient liquid phase bonding behaviour of a duplex stainless steel using copper interlayers

    Padron, T. / Khan, T. I. / Kabir, M. J. | British Library Online Contents | 2004

    Ceramic joining: Part I Partial transient liquid-phase bonding of alumina via Cu/Pt interlayers

    Shalz, M. L. / Dalgleish, B. J. / Tomsia, A. P. et al. | British Library Online Contents | 1993

    Ceramic joining II Partial transient liquid-phase bonding of alumina via Cu/Ni/Cu multilayer interlayers

    Shalz, M. L. / Dalgleish, B. J. / Tomsia, A. P. et al. | British Library Online Contents | 1994

    Back to top