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Cu films by partially ionized beam deposition for ultra large scale integration metallization

Kim, K.-H. / Jang, H.-G. / Han, S. / Jung, H.-J. / Koh, S.-K. / Choi, D.-J.

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Cu films by partially ionized beam deposition for ultra large scale integration metallization

Kim, K.-H. / Jang, H.-G. / Han, S. / Jung, H.-J. / Koh, S.-K. / Choi, D.-J.

Cu films by partially ionized beam deposition for ultra large scale integration metallization

Kim, K.-H. / Jang, H.-G. / Han, S. / Jung, H.-J. / Koh, S.-K. / Choi, D.-J.

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Check availability in my library

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Document information

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Document information

Title:

Cu films by partially ionized beam deposition for ultra large scale integration metallization

Contributors:

Kim, K.-H. (author) / Jang, H.-G. (author) / Han, S. (author) / Jung, H.-J. (author) / Koh, S.-K. (author) / Choi, D.-J. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 13 ; 1158-1163

Publication date:

1998-01-01

Size:

6 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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