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Novel high performance no flow and reworkable underfills for flip-chip applications

Wong, C. P. / Wang, L. / Shi, S.-H.

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Novel high performance no flow and reworkable underfills for flip-chip applications

Wong, C. P. / Wang, L. / Shi, S.-H.

Novel high performance no flow and reworkable underfills for flip-chip applications

Wong, C. P. / Wang, L. / Shi, S.-H.

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Document information

Title:

Novel high performance no flow and reworkable underfills for flip-chip applications

Contributors:

Wong, C. P. (author) / Wang, L. (author) / Shi, S.-H. (author)

Published in:

MATERIALS RESEARCH INNOVATIONS ; 2 ; 232-247

Publication date:

1999-01-01

Size:

16 pages

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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