A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Mechanical strength of chip scale package with various underfills under accelerated thermal condition
Mechanical strength of chip scale package with various underfills under accelerated thermal condition
Mechanical strength of chip scale package with various underfills under accelerated thermal condition
Noh, B.-I. (author) / Lee, B.-Y. (author) / Jung, S.-B. (author)
MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 23 ; 828-832
2007-01-01
5 pages
Article (Journal)
English
DDC:
620.11
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