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Novel high performance no flow and reworkable underfills for flip-chip applications

Wong, C. P. / Wang, L. / Shi, S.-H.

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Novel high performance no flow and reworkable underfills for flip-chip applications

Wong, C. P. / Wang, L. / Shi, S.-H.

Novel high performance no flow and reworkable underfills for flip-chip applications

Wong, C. P. / Wang, L. / Shi, S.-H.

Zugriff

Seitennavigation

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

Novel high performance no flow and reworkable underfills for flip-chip applications

Beteiligte:

Wong, C. P. (Autor:in) / Wang, L. (Autor:in) / Shi, S.-H. (Autor:in)

Erschienen in:

MATERIALS RESEARCH INNOVATIONS ; 2 ; 232-247

Erscheinungsdatum:

01.01.1999

Format / Umfang:

16 pages

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Noh, B. I. / Jung, S. B. | British Library Online Contents | 2006

Borchardt, J. K. | British Library Online Contents | 2004

Mihelcic, S. | British Library Online Contents | 2002

Noh, B.-I. / Lee, B.-Y. / Jung, S.-B. | British Library Online Contents | 2007

Chan, B. / Chu, R. / Toleno, B. | British Library Online Contents | 2008