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Diffusion and intermetallics formation between Pd/Ag metallization and Sn/Pb/Ag solder in surface mount solder joints
Diffusion and intermetallics formation between Pd/Ag metallization and Sn/Pb/Ag solder in surface mount solder joints
Diffusion and intermetallics formation between Pd/Ag metallization and Sn/Pb/Ag solder in surface mount solder joints
Li, G. Y. (author) / Chan, Y. C. (author)
MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- B ; 57 ; 116-126
1999-01-01
11 pages
Article (Journal)
English
DDC:
620.11
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