Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Diffusion and intermetallics formation between Pd/Ag metallization and Sn/Pb/Ag solder in surface mount solder joints
Diffusion and intermetallics formation between Pd/Ag metallization and Sn/Pb/Ag solder in surface mount solder joints
Diffusion and intermetallics formation between Pd/Ag metallization and Sn/Pb/Ag solder in surface mount solder joints
Li, G. Y. (Autor:in) / Chan, Y. C. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- B ; 57 ; 116-126
01.01.1999
11 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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