Elimination of Au-embrittlement in solder joints on Au/Ni metallization: Fid-Bau Portal

Elimination of Au-embrittlement in solder joints on Au/Ni metallization

Alam, M. O. / Chan, Y. C. / Tu, K. N.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Elimination of Au-embrittlement in solder joints on Au/Ni metallization

Alam, M. O. / Chan, Y. C. / Tu, K. N.

Elimination of Au-embrittlement in solder joints on Au/Ni metallization

Alam, M. O. / Chan, Y. C. / Tu, K. N.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Elimination of Au-embrittlement in solder joints on Au/Ni metallization

Contributors:

Alam, M. O. (author) / Chan, Y. C. (author) / Tu, K. N. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 1303-1306

Publication date:

2004-01-01

Size:

4 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Hata, Hanae / Maruya, Yuuki / Shohji, Ikuo | British Library Online Contents | 2016

Diffusion and intermetallics formation between Pd/Ag metallization and Sn/Pb/Ag solder in surface mount solder joints

Li, G. Y. / Chan, Y. C. | British Library Online Contents | 1999

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization

Zhong, W. H. / Chan, Y. C. / Wu, B. Y. et al. | British Library Online Contents | 2007

Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints

Lee, K. O. / Yu, J. / Park, T. S. et al. | British Library Online Contents | 2013

BGA Solder Joints

Kongcharoen, A. / Trongjitwikrai, S. / Netphu, S. | British Library Online Contents | 2002