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A study on resistance of PECVD silicon nitride thin film to thermal stress-induced cracking

Jo, M.-C. / Park, S.-K. / Park, S.-J.

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A study on resistance of PECVD silicon nitride thin film to thermal stress-induced cracking

Jo, M.-C. / Park, S.-K. / Park, S.-J.

A study on resistance of PECVD silicon nitride thin film to thermal stress-induced cracking

Jo, M.-C. / Park, S.-K. / Park, S.-J.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

A study on resistance of PECVD silicon nitride thin film to thermal stress-induced cracking

Contributors:

Jo, M.-C. (author) / Park, S.-K. (author) / Park, S.-J. (author)

Published in:

APPLIED SURFACE SCIENCE ; 140 ; 12-18

Publication date:

1999-01-01

Size:

7 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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