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Mechanical stability and electrical conductivity of Cu-Ag filamentary microcomposites

Hong, S. I. / Hill, M. A.

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Mechanical stability and electrical conductivity of Cu-Ag filamentary microcomposites

Hong, S. I. / Hill, M. A.

Mechanical stability and electrical conductivity of Cu-Ag filamentary microcomposites

Hong, S. I. / Hill, M. A.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Mechanical stability and electrical conductivity of Cu-Ag filamentary microcomposites

Contributors:

Hong, S. I. (author) / Hill, M. A. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 264 ; 151-158

Publication date:

1999-01-01

Size:

8 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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