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    Endurance of thermoset resins for flip chip encapsulation

    New search for: Sarkar, G.
    New search for: Ng, H. W.
    New search for: Law, S. B.

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    Endurance of thermoset resins for flip chip encapsulation

    New search for: Sarkar, G.
    New search for: Ng, H. W.
    New search for: Law, S. B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Endurance of thermoset resins for flip chip encapsulation

    New search for: Sarkar, G.
    New search for: Ng, H. W.
    New search for: Law, S. B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Endurance of thermoset resins for flip chip encapsulation

    Contributors:

    Sarkar, G. (author) / Ng, H. W. (author) / Law, S. B. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE LETTERS ; 18 ; 423-424

    Publication date:

    1999-01-01

    Size:

    2 pages

    ISSN:

    0261-8028

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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