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A cleaning process for flip chip assemblies before encapsulation

Sarkar, G. / Chong, Y. F. / Collier, P. A.

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A cleaning process for flip chip assemblies before encapsulation

Sarkar, G. / Chong, Y. F. / Collier, P. A.

A cleaning process for flip chip assemblies before encapsulation

Sarkar, G. / Chong, Y. F. / Collier, P. A.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

A cleaning process for flip chip assemblies before encapsulation

Contributors:

Sarkar, G. (author) / Chong, Y. F. (author) / Collier, P. A. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE LETTERS ; 18 ; 63-66

Publication date:

1998-01-01

Size:

4 pages

ISSN:

0261-8028

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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