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Wafer Bonding and Layer Splitting for Microsystems

Tong, Q.-Y. / Goesele, U. M.

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Wafer Bonding and Layer Splitting for Microsystems

Tong, Q.-Y. / Goesele, U. M.

Wafer Bonding and Layer Splitting for Microsystems

Tong, Q.-Y. / Goesele, U. M.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Wafer Bonding and Layer Splitting for Microsystems

Contributors:

Tong, Q.-Y. (author) / Goesele, U. M. (author)

Published in:

ADVANCED MATERIALS -DEERFIELD BEACH- ; 11 ; 1409-1425

Publication date:

1999-01-01

Size:

17 pages

ISSN:

0935-9648

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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