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sSOI fabrication by wafer bonding and layer splitting of thin SiGe virtual substrates
sSOI fabrication by wafer bonding and layer splitting of thin SiGe virtual substrates
sSOI fabrication by wafer bonding and layer splitting of thin SiGe virtual substrates
Radu, I. (author) / Himcinschi, C. (author) / Singh, R. (author) / Reiche, M. (author) / Gosele, U. (author) / Christiansen, S. H. (author) / Buca, D. (author) / Mantl, S. (author) / Loo, R. (author) / Caymax, M. (author)
MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 135 ; 231-234
2006-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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