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Si layer transfer to InP substrate using low-temperature wafer bonding

Arokiaraj, J. / Tripathy, S. / Vicknesh, S. / Chua, S. J.

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Si layer transfer to InP substrate using low-temperature wafer bonding

Arokiaraj, J. / Tripathy, S. / Vicknesh, S. / Chua, S. J.

Si layer transfer to InP substrate using low-temperature wafer bonding

Arokiaraj, J. / Tripathy, S. / Vicknesh, S. / Chua, S. J.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Si layer transfer to InP substrate using low-temperature wafer bonding

Contributors:

Arokiaraj, J. (author) / Tripathy, S. (author) / Vicknesh, S. (author) / Chua, S. J. (author)

Published in:

APPLIED SURFACE SCIENCE ; 253 ; 1243-1246

Publication date:

2006-01-01

Size:

4 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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