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Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles

Shi, F.G. / Abdullah, M. / Chungpaiboonpatana, S. / Okuyama, K. / Davidson, C. / Adams, J.M.

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Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles

Shi, F.G. / Abdullah, M. / Chungpaiboonpatana, S. / Okuyama, K. / Davidson, C. / Adams, J.M.

Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles

Shi, F.G. / Abdullah, M. / Chungpaiboonpatana, S. / Okuyama, K. / Davidson, C. / Adams, J.M.

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Document information

Title:

Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles

Contributors:

Shi, F.G. (author) / Abdullah, M. (author) / Chungpaiboonpatana, S. (author) / Okuyama, K. (author) / Davidson, C. (author) / Adams, J.M. (author)

Published in:

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING ; 2 ; 263-269

Publication date:

1999-01-01

Size:

7 pages

ISSN:

1369-8001

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.38152

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