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Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles

Shi, F.G. / Abdullah, M. / Chungpaiboonpatana, S. / Okuyama, K. / Davidson, C. / Adams, J.M.

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Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles

Shi, F.G. / Abdullah, M. / Chungpaiboonpatana, S. / Okuyama, K. / Davidson, C. / Adams, J.M.

Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles

Shi, F.G. / Abdullah, M. / Chungpaiboonpatana, S. / Okuyama, K. / Davidson, C. / Adams, J.M.

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Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Ähnliche Titel

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Titel:

Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles

Beteiligte:

Shi, F.G. (Autor:in) / Abdullah, M. (Autor:in) / Chungpaiboonpatana, S. (Autor:in) / Okuyama, K. (Autor:in) / Davidson, C. (Autor:in) / Adams, J.M. (Autor:in)

Erschienen in:

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING ; 2 ; 263-269

Erscheinungsdatum:

01.01.1999

Format / Umfang:

7 pages

ISSN:

1369-8001

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 621.38152

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Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives

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