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Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip-chip interconnection

Yim, M. J. / Kwon, W. / Paik, K. W.

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Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip-chip interconnection

Yim, M. J. / Kwon, W. / Paik, K. W.

Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip-chip interconnection

Yim, M. J. / Kwon, W. / Paik, K. W.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip-chip interconnection

Contributors:

Yim, M. J. (author) / Kwon, W. (author) / Paik, K. W. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 126 ; 59-65

Publication date:

2006-01-01

Size:

7 pages

ISSN:

0921-5107

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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