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Mixed Assembly on PCB using a Novel Flip-Chip Technology
Mixed Assembly on PCB using a Novel Flip-Chip Technology
Mixed Assembly on PCB using a Novel Flip-Chip Technology
Vanfleteren, J. (author) / Stoukatch, S. (author) / Vandecasteele, B. (author) / Van Calster, A. (author)
ADVANCING MICROELECTRONICS ; 27 ; 28-31
2000-01-01
4 pages
Article (Journal)
English
DDC:
621.381
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