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    Mixed Assembly on PCB using a Novel Flip-Chip Technology

    New search for: Vanfleteren, J.
    New search for: Stoukatch, S.
    New search for: Vandecasteele, B.
    New search for: Van Calster, A.

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    Mixed Assembly on PCB using a Novel Flip-Chip Technology

    New search for: Vanfleteren, J.
    New search for: Stoukatch, S.
    New search for: Vandecasteele, B.
    New search for: Van Calster, A.

    Access

    Access via TIB
    Check availability in my library

    Mixed Assembly on PCB using a Novel Flip-Chip Technology

    New search for: Vanfleteren, J.
    New search for: Stoukatch, S.
    New search for: Vandecasteele, B.
    New search for: Van Calster, A.

    Access

    Access via TIB
    Check availability in my library

    Access

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    Check availability in my library

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    Document information
    Title:

    Mixed Assembly on PCB using a Novel Flip-Chip Technology

    Contributors:

    Vanfleteren, J. (author) / Stoukatch, S. (author) / Vandecasteele, B. (author) / Van Calster, A. (author)

    Published in:

    ADVANCING MICROELECTRONICS ; 27 ; 28-31

    Publication date:

    2000-01-01

    Size:

    4 pages

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.381

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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