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    Modeling of electromechanically-induced failure of passivated metallic thin films used in device interconnections

    New search for: Gungor, M. R.
    New search for: Maroudas, D.

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    Modeling of electromechanically-induced failure of passivated metallic thin films used in device interconnections

    New search for: Gungor, M. R.
    New search for: Maroudas, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Modeling of electromechanically-induced failure of passivated metallic thin films used in device interconnections

    New search for: Gungor, M. R.
    New search for: Maroudas, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Title:

    Modeling of electromechanically-induced failure of passivated metallic thin films used in device interconnections

    Contributors:

    Gungor, M. R. (author) / Maroudas, D. (author)

    Published in:

    INTERNATIONAL JOURNAL OF FRACTURE ; 109 ; 47-68

    Publication date:

    2001-01-01

    Size:

    22 pages

    ISSN:

    0376-9429

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1126

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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