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Chemical stresses induced by grain-boundary diffusion in thin films

Wang, W. L. / Chou, Y. T. / Lee, S.

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Chemical stresses induced by grain-boundary diffusion in thin films

Wang, W. L. / Chou, Y. T. / Lee, S.

Chemical stresses induced by grain-boundary diffusion in thin films

Wang, W. L. / Chou, Y. T. / Lee, S.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Chemical stresses induced by grain-boundary diffusion in thin films

Contributors:

Wang, W. L. (author) / Chou, Y. T. (author) / Lee, S. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 16 ; 1967-1974

Publication date:

2001-01-01

Size:

8 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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