A platform for research: civil engineering, architecture and urbanism
Chip Scale Packaging for Power Devices
Barlow, F. (author)
ADVANCING MICROELECTRONICS ; 28 ; 11-16
2001-01-01
6 pages
Article (Journal)
English
DDC:
621.381
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Leadframe Chip Scale Packaging
British Library Online Contents | 2003
|Wafer Level Chip Scale Packaging (WLCSP)
British Library Online Contents | 2008
EMI filter packaging Chip scale packages enhance performance
British Library Online Contents | 2002
|Micro-contact CSP: A Next-generation Chip-scale Packaging Solution
British Library Online Contents | 2007
|Packaging & Application of Power LED Devices
British Library Online Contents | 2008