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Micro-contact CSP: A Next-generation Chip-scale Packaging Solution

Moran, S. / Solberg, V. / Wade, C. P.

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Micro-contact CSP: A Next-generation Chip-scale Packaging Solution

Moran, S. / Solberg, V. / Wade, C. P.

Micro-contact CSP: A Next-generation Chip-scale Packaging Solution

Moran, S. / Solberg, V. / Wade, C. P.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Micro-contact CSP: A Next-generation Chip-scale Packaging Solution

Contributors:

Moran, S. (author) / Solberg, V. (author) / Wade, C. P. (author)

Published in:

ADVANCED PACKAGING ; 16 ; 38-41

Publication date:

2007-01-01

Size:

4 pages

ISSN:

1065-0555

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 658.564

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